Daewon Innost introduced a Glaxum (TM) LED Array family of Chip-On Board modules using proprietary Nano-Pore Silicon Substrate (NPSS) technology. The Glaxum arrays provide the industry’s best thermal dissipation performance and are built using some of the highest efficacy, commercially available 1 Watt LED chips. Glaxum technology offers the best thermal impedance in the industry - only 0.41 degrees centigrade per watt - and by running more than 12 degrees centigrade cooler than previous top performing COB modules the Glaxum line significantly extends LED array lifetime.
 
Daewon Innost developed the NPSS technology for LED modules specifically to provide the best thermal dissipation performance available today. The LED substrate is created by applying semiconductor lithography to silicon wafers allowing for fine pitch interconnection between GaN LED chips, providing a pitch spacing of 50 microns as compared to over 300 microns with current Metal Core Printed Circuit Board (MCPCB). NPSS offers several advantages over MCPCB including superior thermal performance, higher levels of integration, and favorable scaling which will offer lower system costs as power levels increase.
 
The Glaxum NPSS modules are available in models ranging from 3.5 to 100 Watts. The models with lowest thermal impedance are Glaxum-MCL-GL-WC-020-002 (warm white) and the Glaxum-MCL-GL-CC-020-002 (cool white). Tested voltage and current value of Glaxum module is 16.6 V, 1.2 A, respectively.