According to industry sources, Ta-I Technology, supplier of chip resistors, and Viking Tech, provider of thin-film integrated passive devices, have expanded the manufacturing of ceramic heat dissipation substrates used in packaging LED chips for lighting application and may obtain orders from big name buyers in the second half of 2012.
 
With a monthly production capacity of 200,000 heat dissipation substrates, Ta-I currently ships 50,000 substrates a month to account for 5% of its total revenues, the sources indicated. However, Ta-I has had its heat dissipation substrates trialed by several LED lighting players, including Osram, Cree and Philips, and may obtain orders from them in the second half of 2012. Therefore, Ta-I aims to increase revenues from heat dissipation substrates to 10% of its 2012 total revenues, the sources noted.
 
Viking Tech has passed certification for heat dissipation substrates by Taiwan-based packaging houses of high-power LED chips, the sources indicated. With orders received for shipments to end in five weeks and monthly shipments of 30,000 heat dissipation substrates currently, Viking Tech may expand its monthly production capacity from 120,000 units to 200,000 units, the sources said. Viking Tech hopes that heat dissipation substrates could take up 30% of its total revenues in 2012, the sources noted.