Osram Opto Semiconductors has developed a concept for ceramic LED components, such as the Oslon family, that makes the board solder pad design so adaptable that it can be used for LED components from at least two different manufacturers. The concept can also be used for metal core, FR4 and ceramic boards.

“Only a small adjustment to the process is needed, and the benefits are real and long-term,” according to Dr. Christian Gartner, Oslon Project Manager in Product Development General Lighting at Osram Opto Semiconductors. The combined board design comes from the design of one of the two LED components. The individual solder surfaces are divided into segments – electrically connected and electrically disconnected. By selecting appropriate spacings between the solder surfaces, the second LED product – rotated 90° – can be attached to the uniform board design. The anode and cathode of the two LED components are connected to the same electrically contacted segments. By dividing the solder surfaces the two LED types automatically align themselves to the edges of the solder surfaces during the reflow solder process. For both LED components, the luminous area is in the same lateral position on the board – in other words, in the same alignment in the board plane. If the LEDs have the same emission behavior, the same secondary lenses and reflectors can be used. This means that neither the LED components nor the end application are changed in terms of their characteristics.

The new concept makes it much easier to handle LED components from different manufacturers because there is no longer the need to make modifications to the board design. What’s more, there is no need for duplicated storage, reducing costs still further. Dr. Gartner sums up the benefits as follows: “The efficiency and performance of our Oslon family is undisputed worldwide. The concept for a flexible solder pad design gives our customers the freedom to incorporate a second source for our high-power LED components without having to suffer restrictions due to mechanical parameters."