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lan, a specialized manufacturer in semiconductor microelectronics, has received a notice indicating the successful approval of its national science and technology major project from The Ministry of Science and Technology. This project called intelligent sensor making and packaging one-body integrated technology aimed at mobile terminal and Internet of Things is initiated and submitted by Silan and is now undertaken by Silan, its subsidiary Silan Integrated Circuit and the third-party.
Silan and its subsidiary will receive RMB 15.88m and RMB 35.59m respectively, a total sum of RMB 51.47m subsidiaries, the payment of which will be made after the approval with a startup capital being paid in advance.