IDEC, a public company based in Tokyo, Japan, has utilized blue LED elements and yellow fluorescent materials to develop pseudo white LED modules.
 
Under IDEC’s new method, an LED device can be packaged just by covering it with a gel-like silicon resin sheet containing a fluorescent material and heating it.
 
Compared with a conventional method that packages an LED device by inpouring liquid resin, the new method can reduce the time used for packaging process to 1/9.
 
IDEC, which consolidated its production bases for white LED modules for lighting devices in its Hamamatsu Plant, plans to apply the new manufacturing method to all of its modules within fiscal 2013.